文章标题： Thermal Mechanical Property Testing of New Lead-Free Solder Joints
文献名称： Soldering Surf Mount Technol
关 键 字： SOLDERING ALLOYS;SHEAR STRENGTH;MECHANICAL PROPERTIES;PROPERTIES;SHEAR PROPERTIES;SOLDERED ASSEMBLIES;SUBSTITUTION;COMPETITIVE MATERIALS;LAP SHEAR PROPERTIES;FRACTURE APPEARANCE;ELEVATED TEMPERATURE PROPERTIES;ELEVATED TEMPERATURE;ELEVATED TEMPERATURE (20-100C);TEMPERATURE;ELECTRONIC PRODUCTS;APPLICATIONS
文章摘要： A study of the use of a new non-toxic solder alloy. A comparison has been carried out against eutectic 63Sn37Pb and lead-free 96.5Sn3.5Ag materials. Shear strength at different temperatures has been measured and it was established that the new alloys of 80Sn, 5-14.5In, 4.5-14.5Bi, 0.5Ag (weight percent), are potential replacements for currently used Sn-Pb solder alloys.
文章作者： Ren, W;Lu, M;Liu, S;Shangguan, D
作者单位：
机械制造文献