文章标题： The evolution of microstructure during hot plane strain compression of Al-0.3Mn
文献名称： Swedish Society for Materials Technology (Sweden), pp. 184-192, 1997 91-630-5421-3
关 键 字： Conference Paper;Aluminum base alloys, Mechanical properties; Texture;Strain;Stresses;Hot deformation;Cold deformation; Transmission electron microscopy;X ray diffraction;Grain size
文章摘要： A characterization of the hot and cold plane strain deformation behavior of high purity single-phase Al-0.3Mn alloy was examined. Specimens have been cold and hot deformed in channel die and plane strain compression. Evolution of substructure with strain has been investigated in the temperature range RT-500 deg C, at a number of strain rates. The substructure was characterized in terms of cell size, boundary misorientation, and substructure alignment using optical and electron microscopy (including EBSD and TEM microtexture), and bulk texture x-ray diffraction. The variations in subgrain size with strain and temperature have been measured and related to the flow stress. The amount of deformation banding is less at lower strains and at higher deformation temperatures. Alignment of the substructure has also been observed and analyzed with respect to its relation to the {111} plane traces and the angle made to the rolling direction.
文章作者： Ball, EA;Humphreys, F
作者单位： Manchester Materials Science Centre;Manchester Materials Science Centre
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